Q&A with Ann Kelleher, SVP & GM of Technology Development at Intel on the company's new logic roadmap, lithography, packaging, and process technology (Semiconductor Engineering)

Semiconductor Engineering:
Q&A with Ann Kelleher, SVP & GM of Technology Development at Intel on the company's new logic roadmap, lithography, packaging, and process technology  —  Five process nodes in four years, high-NA EUV, 3D-ICs, chiplets, hybrid bonding, and more.  —  Ann Kelleher, senior vice president …



from Techmeme https://ift.tt/3DrD4BN

Comments

Popular posts from this blog

Microsoft says it has no plans to add more backward compatible titles for Xbox One, but says Project Scarlett will run games from all four Xbox generations (Tom Warren/The Verge)

Tencent-backed Chinese online education startup Huohua Siwei, which offers K-12 math and science courses, closes its $400M Series E at a $1.5B valuation (Emma Lee/TechNode)

SetSail raises $26M Series A for its service that recommends when to pay salespeople, by monitoring the progress of sales across CRM, email, and other systems (Ron Miller/TechCrunch)