Q&A with Ann Kelleher, SVP & GM of Technology Development at Intel on the company's new logic roadmap, lithography, packaging, and process technology (Semiconductor Engineering)

Semiconductor Engineering:
Q&A with Ann Kelleher, SVP & GM of Technology Development at Intel on the company's new logic roadmap, lithography, packaging, and process technology  —  Five process nodes in four years, high-NA EUV, 3D-ICs, chiplets, hybrid bonding, and more.  —  Ann Kelleher, senior vice president …



from Techmeme https://ift.tt/3DrD4BN

Comments

Popular posts from this blog

Microsoft says it has no plans to add more backward compatible titles for Xbox One, but says Project Scarlett will run games from all four Xbox generations (Tom Warren/The Verge)

An in-depth look at Mike Speiser's investment playbook at Sutter Hill Ventures, who as a founding investor incubated Snowflake Computing as an interim CEO (Kevin/kwokchain)

Indian neobank Jupiter raises a $86M Series C at a $711M valuation, up from ~$300M in August, as it prepares to launch lending and wealth management services (Manish Singh/TechCrunch)